The objective of this course is to review mold compound materials, properties, mold processes and their effect on package performance. At the end of this course, trainees will understand the importance of Organic Resin, Catalyst, Filler, Flexibilizers and other constituents that make up mold compounds. Trainees will understand how to handle mold compound processing issues, such as delamination, incomplete mold filling, voids and wire sweep.
Trainees will have a firm understanding of:
Glass Transition Temperature (Tg)